Document Type
Thesis
Date of Award
5-31-1988
Degree Name
Master of Science in Electrical Engineering - (M.S.)
Department
Electrical Engineering
First Advisor
Raj Pratap Misra
Second Advisor
S. Pandey
Third Advisor
Edwin Cohen
Abstract
The semiconductor industry is faced with the problems of how to increase the level of reliability of semiconductor parts being used in the electronic systems which have had their lifetimes extended through new and better system design.
This paper deals with the reliability of packaging constructions commonly used in large scale integration / integrated circuits and will present the failure mechanisms and failure modes which can arise when proper processing is used. In addition, the materials used in each construction and how they affect reliabilty will be analyzed.
It is not the intention of this paper to present any new, revolutionary packaging approach, but rather to compare the advantages and disadvantages of the major types as they relate to reliabilty.
Recommended Citation
Iqbal, Zia, "Reliability of packaging in microcircuits" (1988). Theses. 3109.
https://digitalcommons.njit.edu/theses/3109
