SOLID PHASE BONDING OF COPPER-IRON ALLOYS UNDER DEFORMATION.
Document Type
Conference Proceeding
Publication Date
12-1-1986
Abstract
In bimetal or clad technology during joining of dissimilar metals designed from copper-iron alloys the main concern is a quality of diffusion bonding. An experiment was conducted to measure the copper diffusion rate in alpha and gamma irons and the effect of deformation on copper mobility in the area of diffusion zone. The diffusion parameters and their temperature dependence in deformed and non-deformed states were evaluated. The results showed that the diffusion penetration of copper into iron increased sizably with deformation, but the rate of the diffusion increment dropped with an increase in temperature above the transformation line. These results indicate that the probability of diffusion mobility of copper into iron is greater at a temperature range below the critical line when the grain boundary and short circuiting diffusion provide a high diffusion rate.
Identifier
0022938347 (Scopus)
ISBN
[0871702452]
First Page
745
Last Page
749
Recommended Citation
Dubrovsky, Roman, "SOLID PHASE BONDING OF COPPER-IRON ALLOYS UNDER DEFORMATION." (1986). Faculty Publications. 21018.
https://digitalcommons.njit.edu/fac_pubs/21018
