Document Type
Thesis
Date of Award
10-31-1987
Degree Name
Master of Science in Electrical Engineering - (M.S.)
Department
Electrical and Computer Engineering
First Advisor
Raj Pratap Misra
Second Advisor
S. Pandey
Abstract
A model for the ultrasonic bond as used in making microcircuit interconnections was studied. This model was based on Bowden & Tabor's dry friction theory and Mindlin's analysis of Hertz's model for elastic deformation under compressive and shear stresses. To develop a well-controlled bonding system, the critical bonding machine parameters were determined, and a high-frequency capacitor microphone was fitted to the bonding machine to monitor the tool tip oscillation. Application of these techniques made it possible to control the parameters of the machine to ±5%. Flip-chip bond studies were made using this machine. The data obtained were consistent with the bond model. Better correlation was obtained between bond strength and microphone output than between bond strength and power setting. Output waveshapes were monitored and a correlation was found between waveshape and bond strength.
Recommended Citation
Phiniotis, Ioannis Andrea, "Testing of ultrasonic bonding in microcircuits" (1987). Theses. 3297.
https://digitalcommons.njit.edu/theses/3297
