Document Type
Thesis
Date of Award
5-31-1986
Degree Name
Master of Science in Electrical Engineering - (M.S.)
Department
Electrical Engineering
First Advisor
Raj Pratap Misra
Second Advisor
W. H. Warren Ball
Third Advisor
S. Pandey
Abstract
The increased use of microprocessors has brought forth many questions concerning the reliability of these devices.
This research discuss the TTL integrated circuit failure rates, and provides information on the effects of temperature, device complexity and packaging on TTL failure rates under storage condition of 100% R.H. (Relative Humidity) and 100°C and no added humidity at 100°C. Other factors which can affect failure rate are also discussed, including designs, materials process.
Approximately 200 microcircuits of TTL (74LS00) were subjected to extend life testing at 100°C; where 125 chips are tested at 100°C ± 2° and no added humidity and the other 75 chips were tested at 100°C ± 2° and 100% Relative humidity.
In the first part of the paper, is a review of the most important results on failure physics of integrated circuits, as a synthesis of what has been recently encountered in the literature concerned with these problems.
In the second part of the paper, the data was taken at zero, 500 and 1000 hours at two different conditions (100% Relative Humidity and no added humidity, both at 100°C) and was plotted showing the difference at each time.
Recommended Citation
Chaia, Antoine Mikhayel, "Effect of humidity and moderate temperature on microcircuit failure" (1986). Theses. 3137.
https://digitalcommons.njit.edu/theses/3137
