Document Type
Thesis
Date of Award
6-30-1962
Degree Name
Master of Science in Chemical Engineering - (M.S.)
Department
Chemical Engineering
First Advisor
C. L. Mantell
Second Advisor
Jerome J. Salamone
Third Advisor
Michael Frederick
Abstract
The thermal conductivity of an epoxy compound commonly used as an adhesive, was measured using asimple apparatus specially designed to simulate adhesion, to minimize heat losses, and to simplify measurement and correction for heat losses. Variation of heat conductivity coefficient with glue line thickness and temperature was investigated. The results do not indicate that there is any consistent correlation between the heat conductiv¬ity coefficient and glue line thickness or between heat conductivity coefficient and temperature. However, the small number of samples measured does not permit any definite conclusions to be drawn. The sample with glue line thickness below 0.025 millimeters had a smaller heat conductivity coefficient than samples of thicker glue line. This can be partially explained by a larger error in the determination of thickness. The effect of oxidation of the bonding surfaces on the thermal conductivity of the joint with a thin glue line was also investigated. The resistance of the adhesive layer was found to be controlling. Values of heat conductivity coefficient found in this experiment agree with published values for unfilled epoxy adhesives.
Recommended Citation
Klosowski, Stanley I., "Heat conductivity of adhesively bonded assemblies" (1962). Theses. 3080.
https://digitalcommons.njit.edu/theses/3080
