"Heat conductivity of adhesively bonded assemblies" by Stanley I. Klosowski

Document Type

Thesis

Date of Award

6-30-1962

Degree Name

Master of Science in Chemical Engineering - (M.S.)

Department

Chemical Engineering

First Advisor

C. L. Mantell

Second Advisor

Jerome J. Salamone

Third Advisor

Michael Frederick

Abstract

The thermal conductivity of an epoxy compound commonly used as an adhesive, was measured using asimple apparatus specially designed to simulate adhesion, to minimize heat losses, and to simplify measurement and correction for heat losses. Variation of heat conductivity coefficient with glue line thickness and temperature was investigated. The results do not indicate that there is any consistent correlation between the heat conductiv¬ity coefficient and glue line thickness or between heat conductivity coefficient and temperature. However, the small number of samples measured does not permit any definite conclusions to be drawn. The sample with glue line thickness below 0.025 millimeters had a smaller heat conductivity coefficient than samples of thicker glue line. This can be partially explained by a larger error in the determination of thickness. The effect of oxidation of the bonding surfaces on the thermal conductivity of the joint with a thin glue line was also investigated. The resistance of the adhesive layer was found to be controlling. Values of heat conductivity coefficient found in this experiment agree with published values for unfilled epoxy adhesives.

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