Document Type


Date of Award


Degree Name

Master of Science in Electrical Engineering - (M.S.)


Electrical Engineering

First Advisor

Yun Q. Shi

Second Advisor

Nirwan Ansari

Third Advisor

Edwin Hou

Fourth Advisor

Shu, C.Q.


This thesis reports the research results of automatic inspection of solder joints on printed circuit boards (PCBs). The previous work on this regard has been advanced significantly in the following three aspects. With the application of some microlens and the principle of geometric optics solder joints of real size are inspected in this work instead of larger simulation solder joints in the previous work. A new set of features is formulated and used for infrared inspection. Consequently, better results have been achieved in this work.

Reasonably good results demonstrate the capability of infrared inspection of solder joints on PCBs. Once again, the fusion of infrared and visual imaging techniques for the inspection is proved to bring out better results than that obtained by using each technique alone.



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