Date of Award
Master of Science in Chemical Engineering - (M.S.)
Chemical Engineering, Chemistry and Environmental Science
Norman W. Loney
The use of ultra thin oxide films in modem semiconductor devices makes them increasingly susceptible to damage due to the hot carrier damage. Deuterium in place of hydrogen was introduced by ion implantation at the silicon oxide-silicon interface during fabrication to satisfy the dangling bonds. Deuterium was implanted at energies of 15, 25 and 35 keV and at a dose of 1x1014/cm2. Some of the wafers were subjected to N2O annealing following gate oxide growth. It was demonstrated that ion implantation is an effective means of introduction of deuterium. Deuterium implantation brings about a clear enhancement in gate oxide quality by improving the interface characteristics. N2O annealing further improves device performance. A reduction of electron traps with deutenum was also observed. A combination of deuterium implantation at 25 keV and a dose of 1x1015/cm2, followed by annealing in N2O was observed to have the most positive influence on device behavior.
Concurrently, MEMS microheaters being fabricated for an integrated VOC sensor were also tested for their temperature response to an applied voltage. Different channel configurations and materials for the conducting film were compared and the best pattern for rapid heating was identified. Temperature rises of upto 390° C were obtained. The temperature responses after coating spin-on glass in the microchannels were also measured.
Kishore, Sumit, "Study of the effects of deuterium implantation upon the performance of thin-oxide CMOS devices" (1999). Theses. 855.