Document Type
Thesis
Date of Award
5-31-1988
Degree Name
Master of Science in Electrical Engineering - (M.S.)
Department
Electrical Engineering
First Advisor
Raj Pratap Misra
Second Advisor
Mauro Zambuto
Abstract
Increasing power and power densities in new high complexity semiconductor devices are creating heat removal problems. Increased powers produce higher junction temperature which lead to potentially faster degradation of device reliability. Thermal management at device level packaging involves efficient and cost-effective removal of dissipated thermal energy from the device to assure its reliable performance over the long term. In the context of very high levels of integeration of future ICs, thermal management will mean making such devices possible close to the limits of acceptable high temperature.
The major factors affecting heat flow in a plastic Dual-in-line-packages (DIP'S) are investigated using thermal resistance measurements of packages considering various materials and design permutations. This thesis will present trends in important parameters and discuss solutions through experiments and examples.
Recommended Citation
Ahmed, Wasim, "Temperature dependent reliability of plastic packaged microcircuits" (1988). Theses. 3002.
https://digitalcommons.njit.edu/theses/3002
