Document Type


Date of Award

Fall 1-31-2017

Degree Name

Master of Science in Materials Science and Engineering - (M.S.)


Committee for the Interdisciplinary Program in Materials Science and Engineering

First Advisor

N. M. Ravindra

Second Advisor

Michael Jaffe

Third Advisor

Eon Soo Lee


The purpose of this thesis is to study the heat transfer in silicon. Silicon is the key semiconductor material, and thermal processing is the traditional method that is used in semiconductor processing. In this research, we can predict the temperature of the silicon wafer during heating. This ability to predict wafer temperature during semiconductor processing will facilitate in the following: (a) Process temperature uniformity, (b) Film thickness uniformity, (c) Diffusion, (d) Process yield, (e) Thermally induced stresses, and (f) Device yield - spatially and temporally across the wafer. For low temperature applications, IC chips can be modeled to simulate the heat flow. Therefore, the status of the chip while heating can be studied to understand the influence of the heating process on the performance of the chips, which is useful in the assessment of device performance and reliability.

The research, in this thesis, utilizes a traditional hot plate as the source of heating of the silicon wafer. The modeling of heating of the wafer is based on ANSYS CFX software, a software tool that permits to solve fluid flow problems. The model considers heat conduction in silicon wafer, heat convection in air, and heat radiation. The influence of silicon wafer thickness and diameter on the wafer temperature distribution is simulated.



To view the content in your browser, please download Adobe Reader or, alternately,
you may Download the file to your hard drive.

NOTE: The latest versions of Adobe Reader do not support viewing PDF files within Firefox on Mac OS and if you are using a modern (Intel) Mac, there is no official plugin for viewing PDF files within the browser window.