Date of Award
Master of Science in Materials Science and Engineering - (M.S.)
Committee for the Interdisciplinary Program in Materials Science and Engineering
N. M. Ravindra
Eon Soo Lee
The purpose of this thesis is to study the heat transfer in silicon. Silicon is the key semiconductor material, and thermal processing is the traditional method that is used in semiconductor processing. In this research, we can predict the temperature
Huang, Chihlin, "Heat transfer in silicon – experiments and simulation" (2017). Theses. 3.