Document Type
Thesis
Date of Award
6-30-1990
Degree Name
Master of Science in Electrical Engineering - (M.S.)
Department
Electrical and Computer Engineering
First Advisor
Raj Pratap Misra
Second Advisor
William N. Carr
Abstract
Stability and reliability of microcircuit is dependent on its design, fabrication, testing, storage and use.
In this thesis emphasis is given on various failure mechanisms of Integrated Circuits in humid environment and techniques of improving reliability. Other factors which affect the failure of integrated circuits are also discussed. Moisture induced failure modes, semi-reversible failures and irreversible failures (surface leakage current and corrosion-causing interruption of interconnection lines) are also reviewed.
Controlling the contaminants and moisture related corrosion are also covered. The quickest way to evaluate the reliability of microcircuit is by accelerated aging test and by selection of meaningful criteria of the acceptance or rejection of a particular device. The data presented in this thesis has been taken from such tests.
An extensive bibliography is given in a chronological order to help further research in this area.
Recommended Citation
Patel, Chandrabala D., "Effect of moisture on microcircuit failure" (1990). Theses. 2888.
https://digitalcommons.njit.edu/theses/2888
