Document Type
Thesis
Date of Award
1-31-1989
Degree Name
Master of Science in Electrical Engineering - (M.S.)
Department
Electrical Engineering
First Advisor
Raj Pratap Misra
Second Advisor
S. Pandey
Third Advisor
Frederick D. Chichester
Abstract
Today, reliability is acknowledged as an important item in design and operation of electronics circuits and system.
This thesis provides information on evaluation of the reliability for hermetic and non hermetic IC packages made by different manufacturers.
Literature study concentrates on the reliability and related problems in IC packages developed between 1970 and 1988.
Several failure mechanisms and failure modes are discussed to point out how higher reliability in IC packages may be achieved.
The bibliography is given in a chronological order to help further research in this area.
Recommended Citation
Patel, Dilip J., "Reliability problems and failure mechanisms in IC packaging" (1989). Theses. 2862.
https://digitalcommons.njit.edu/theses/2862
