Document Type

Thesis

Date of Award

12-31-1990

Degree Name

Master of Science in Electrical Engineering - (M.S.)

Department

Electrical and Computer Engineering

First Advisor

William N. Carr

Second Advisor

Walter F. Kosonocky

Third Advisor

Durgamadhab Misra

Abstract

A novel X-ray sensor IC has beeli designed which counts individual photons at rates up to 5,000,000 counts per second. A two-dimensional X-ray flip-flop sensor array, consisting of an 30 x 30 matrix of CMOS flip-flop sensors integrated in one chip together with an internal clock generator and access selection circuitry is described. A flip-flop sensing cell contains cross-coupled CMOS devices, one of which is connected to a large-area reverse-biased diode. A large area diode exposed to X-ray flux triggers the flip-flop. By reading out the final stable state of the flip-flop, the absence or presence of an X-ray photon absorption event in the diode can be determined.

An incident X-ray photon absorption event partially discharges the large photodiode to an offset voltage level which triggers the flip-flop. The sensitivity of the flip-flop sensing cell is increased by 44 dB using a synchronous pulsed power bus for level detection. A digital-level serial output is obtained from the chip. The chip design measures 5.2 x 5.2 mm2 based on MOSIS 3-,um, single-level metal, single-level polysilicon process technology.

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