Wafer sojourn time fluctuation analysis of time-constrained dual-arm cluster tools with wafer revisiting and activity time variation

Document Type

Article

Publication Date

4-1-2018

Abstract

A robotic cluster tool involves many activities whose time is subject to some disturbance, thus leading to the activity time variation. It results in wafer sojourn time fluctuation in a process module, which may in turn violate wafer residency time constraints. Some wafer fabrication requires a revisiting process. With wafer revisiting, the effect of activity time variation on wafer sojourn time fluctuation is so complicated that no analysis was reported to the best knowledge of the authors. It is vitally important to accurately analyze it. To do so, this paper adopts a Petri net model to describe the dynamical behavior of cluster tools. With this model, a real-time control policy is proposed to offset the effect of the activity time variation on wafer sojourn time fluctuation as much as possible. Then, the wafer sojourn time delay is analyzed and algorithms are developed to calculate its exact upper bound. With the proposed method, one can check if a given schedule is feasible under bounded activity time variation. Some practical examples are given to show the application of the proposed approach.

Identifier

85027072712 (Scopus)

Publication Title

IEEE Transactions on Systems Man and Cybernetics Systems

External Full Text Location

https://doi.org/10.1109/TSMC.2016.2600583

e-ISSN

21682232

ISSN

21682216

First Page

622

Last Page

636

Issue

4

Volume

48

Grant

61273036

Fund Ref

National Natural Science Foundation of China

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