Wafer sojourn time fluctuation analysis of time-constrained dual-arm cluster tools with wafer revisiting and activity time variation
Document Type
Article
Publication Date
4-1-2018
Abstract
A robotic cluster tool involves many activities whose time is subject to some disturbance, thus leading to the activity time variation. It results in wafer sojourn time fluctuation in a process module, which may in turn violate wafer residency time constraints. Some wafer fabrication requires a revisiting process. With wafer revisiting, the effect of activity time variation on wafer sojourn time fluctuation is so complicated that no analysis was reported to the best knowledge of the authors. It is vitally important to accurately analyze it. To do so, this paper adopts a Petri net model to describe the dynamical behavior of cluster tools. With this model, a real-time control policy is proposed to offset the effect of the activity time variation on wafer sojourn time fluctuation as much as possible. Then, the wafer sojourn time delay is analyzed and algorithms are developed to calculate its exact upper bound. With the proposed method, one can check if a given schedule is feasible under bounded activity time variation. Some practical examples are given to show the application of the proposed approach.
Identifier
85027072712 (Scopus)
Publication Title
IEEE Transactions on Systems Man and Cybernetics Systems
External Full Text Location
https://doi.org/10.1109/TSMC.2016.2600583
e-ISSN
21682232
ISSN
21682216
First Page
622
Last Page
636
Issue
4
Volume
48
Grant
61273036
Fund Ref
National Natural Science Foundation of China
Recommended Citation
Qiao, Yan; Wu, Nai Qi; Yang, Fa Jun; Zhou, Meng Chu; and Zhu, Qing Hua, "Wafer sojourn time fluctuation analysis of time-constrained dual-arm cluster tools with wafer revisiting and activity time variation" (2018). Faculty Publications. 8756.
https://digitalcommons.njit.edu/fac_pubs/8756