Multilevel resistive switching in Hf-based RRAM
Document Type
Conference Proceeding
Publication Date
1-1-2019
Abstract
In this paper, the multilevel switching behaviors of resistive random-access memory (RRAM) devices with three different dielectric materials such as HfO2, HfZrO2 and HfAlO2 are investigated. We have further explored the switching characteristics with two different top electrode materials and with different processing environments. In all devices we have introduced a thin buffer layer to reduce switching power and improve the uniformity. Variation in the resistive behavior (Roff/Ron values) of different RRAM structures were observed and was correlated with possible oxygen vacancy related defects present in the dielectric.
Identifier
85070103514 (Scopus)
ISBN
[9781607688662, 9781607688686, 9781607688693, 9781607688709, 9781607688716, 9781607688723]
Publication Title
Ecs Transactions
External Full Text Location
https://doi.org/10.1149/08903.0039ecst
e-ISSN
19385862
ISSN
19386737
First Page
39
Last Page
44
Issue
3
Volume
89
Recommended Citation
Jain, B.; Huang, C. S.; Misra, D.; Tapily, K.; Clark, R. D.; Consiglio, S.; Wajda, C. S.; and Leusink, G. J., "Multilevel resistive switching in Hf-based RRAM" (2019). Faculty Publications. 7994.
https://digitalcommons.njit.edu/fac_pubs/7994
