"Efficient Approach to Failure Response of Process Module in Dual-Arm C" by Yan Qiao, Siwei Zhang et al.
 

Efficient Approach to Failure Response of Process Module in Dual-Arm Cluster Tools with Wafer Residency Time Constraints

Document Type

Article

Publication Date

3-1-2021

Abstract

In semiconductor manufacturing, a process module (PM) failure in cluster tools (CTs) happens from time to time. To effectively operate a CT, such a failure should be handled in a proper and timely manner. This issue becomes much more complicated because wafer residency time constraints (WRTCs) must be met to ensure the quality for some wafer fabrication processes. With such constraints, if a tool is operated under a periodic schedule and a PM fails, it is desired that the tool can still operate under a periodic schedule if it is possible. Nevertheless, the periodic schedule after a PM failure must be different from that before its failure since in this case the tool is degraded. Thus, there must be a transient process between them. It is a great challenge to operate a tool such that it can go through such a transient process with WRTCs being always satisfied. This paper aims to solve this problem by proposing PM failure response policies which can successfully transfer a CT to the feasible schedule after failure from the one before a failure. Then, efficient algorithms are developed to improve these response policies. The proposed policies are composed of simple control laws such that they can be realized in real time and online. Illustrative examples are presented to show their applications.

Identifier

85101143120 (Scopus)

Publication Title

IEEE Transactions on Systems Man and Cybernetics Systems

External Full Text Location

https://doi.org/10.1109/TSMC.2019.2899590

e-ISSN

21682232

ISSN

21682216

First Page

1612

Last Page

1629

Issue

3

Volume

51

Grant

61673123

Fund Ref

National Natural Science Foundation of China

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