Interlayer bonding strength of 3D printed PEEK specimens
Document Type
Article
Publication Date
5-14-2021
Abstract
Recent advances in extrusion-based filament 3D printing technology enable the processability of high-performance polymers. Poly(ether ether ketone) (PEEK) is an important group of high-performance polymer that has been widely used in aerospace, automotive, and biomedical applications. The interlayer bonding strength of 3D printed PEEK is crucial for load-bearing applications, yet studies on 3D printed PEEK are sparse due to processing challenges. In this study, the three-point flexural test is used to study the interlayer bonding strength of 3D-printed PEEK specimens with respect to the printing process parameters, including nozzle temperature, print speed, layer height, and wait-time. A design of experiment (DOE) approach is developed to study correlations between printing parameters and the end-use properties, including flexural stress (σf) and strain at break (ϵf), flexural modulus (Ef), and crystallinity (χ). Our results show that the nozzle temperature, layer height, and wait-time significantly affect the interlayer bonding strength, with nozzle temperature being the most influential parameter to enhance interlayer bonding strength indicated by a significant increase in σf, ϵf, and χ. Thermal annealing post-printing is shown to increase the degree of χ and Ef, yet its effect on interlayer bonding strength is minimal, indicating that the interlayer bonding strength is primarily determined during the printing process. This study demonstrates the use of a three-point flexural test integrated with a versatile and robust DOE approach to study the interlayer bonding strength of PEEK to reduce product development time while improving mechanical properties.
Identifier
85105772019 (Scopus)
Publication Title
Soft Matter
External Full Text Location
https://doi.org/10.1039/d1sm00417d
e-ISSN
17446848
ISSN
1744683X
PubMed ID
33870997
First Page
4775
Last Page
4789
Issue
18
Volume
17
Grant
DMR-1714882
Fund Ref
National Science Foundation
Recommended Citation
Liaw, Chya Yan; Tolbert, John W.; Chow, Lesley W.; and Guvendiren, Murat, "Interlayer bonding strength of 3D printed PEEK specimens" (2021). Faculty Publications. 4114.
https://digitalcommons.njit.edu/fac_pubs/4114
