Safe usage of C1F 3: Supply, vacuum service, and exhaust gas management

Document Type

Article

Publication Date

9-1-1997

Abstract

Chlorine trifluoride (ClF 3) is a highly reactive process gas used in chemical vapor deposition (CVD) and diffusion furnace applications for nonplasma cleans. Relatively new to US wafer manufacturers, ClF 3 is an aggressive oxidizer. There is growing concern about safety, materials compatibility, and gas handling as CIF 3 is increasingly used in semiconductor processing. Recent work in the laboratory and the field demonstrates an effective, safe system for CIF 3 supply, vacuum service, and abatement.

Identifier

0042993207 (Scopus)

Publication Title

Solid State Technology

ISSN

0038111X

First Page

107

Last Page

114

Issue

9

Volume

40

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