Prediction of cooling time in injection molding by means of a simplified semianalytical equation

Document Type

Article

Publication Date

9-1-2003

Abstract

The prediction of cooling time in injection molding by means of a simplified semianalytical equation was discussed. The equation was found to be based on a convective boundary condition for the mold-part interface and required information on the thermal contact resistance (TCR) or thermal contact conductance (TCC). The analysis showed that the mean error and standard deviation (SD) in cooling time prediction were respectively, -11.61 and 2.27 for polystyrene (PS) and -6.04 and 2.13 for polycarbonate (PC).

Identifier

0041841272 (Scopus)

Publication Title

Advances in Polymer Technology

External Full Text Location

https://doi.org/10.1002/adv.10048

ISSN

07306679

First Page

188

Last Page

208

Issue

3

Volume

22

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