Document Type
Thesis
Date of Award
5-31-1990
Degree Name
Master of Science in Electrical Engineering - (M.S.)
Department
Electrical and Computer Engineering
First Advisor
Yun Q. Shi
Second Advisor
Edwin Hou
Third Advisor
Nirwan Ansari
Abstract
This thesis reports the research work on automatic infrared and visual light inspections of solder joints on printed circuit boards (PCBs) utilizing an image processing system and statistical pattern recognition techniques.
A small scale image processing system, consisting of a SUN workstation and several DATACUBE modules, is set up for the research. Software packages for imaging, displaying and solder joint inspection are developed and ready for public usage.
The capability of infrared inspection for solder joints on PCBs is demonstrated. The fusing of infrared and visual light imagery for the inspection is shown to offer better results than that obtainable by using either infrared or visual light imagery alone. The research work confirms the encouraging expectation of infrared imaging technology in the application of automatic inspection in industries. Further improvements and future research are also presented in the thesis.
Recommended Citation
Zhou, Ken Kekuan, "Automatic infrared inspection of solder joints on mounted circuit boards" (1990). Theses. 3027.
https://digitalcommons.njit.edu/theses/3027
