Document Type


Date of Award


Degree Name

Master of Science in Electrical Engineering - (M.S.)


Electrical and Computer Engineering

First Advisor

Xuan Liu

Second Advisor

Dong Kyun Ko

Third Advisor

Yuanwei Zhang


Phase wrapping artifacts are frequently encountered in phase resolved imaging and sensing techniques based on interferometry. When the value of the actual phase (φ) ranges beyond (-π, π], the extracted phase value (wrapped phase Ψ) is artificially increased or decreased by a multiple of 2π.

In this study, we develop a 3D phase unwrapping method that exploits the correlation of 3D phase data (φ(x,y,t)) over the other dimension (t). We validate our 3D unwrapping method using simulated data, as well as experimental data obtained by optically computed phase microscopy (OCPM) recently developed in our lab. Our results show that the 3D phase unwrapping method achieves accurate and robust reconstruction of phase φ(x,y,t). The application of the 3D phase unwrapping method is not limited to OCPM. Instead, it is a generic approach that can be used for other phase imaging modalities.



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