Embedded Building Components Prototyping with Emerging Technologies

Document Type

Conference Proceeding

Publication Date

1-1-2017

Abstract

This paper discusses research into embedded building assemblies with a focus on distributed sensing, real-time building envelope monitoring, and smart material integration. It looks into extending the concept of the Internet of Things from devices and appliances housed within a building to assemblies and a structure itself. The paper presents a number of embedded research prototypes that address thermal and moisture monitoring as well as introduce capacitive sensing as an opportunity for user monitoring and engagement. Finally, the paper points to opportunities for further extending sensing and actuating capabilities of a building envelope by combining them with embedded materials as a form of user interface.

Identifier

85068385842 (Scopus)

ISBN

[9789491207136]

Publication Title

Proceedings of the International Conference on Education and Research in Computer Aided Architectural Design in Europe

External Full Text Location

https://doi.org/10.52842/conf.ecaade.2017.2.337

ISSN

26841843

First Page

337

Last Page

344

Volume

2

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