Close-down process scheduling of wafer residence time-constrained multi-cluster tools

Document Type

Conference Proceeding

Publication Date

7-21-2017

Abstract

Semiconductor manufacturing industry has adopted multi-cluster tools as wafer fabrication equipment that is extraordinarily pricey but highly attractive owing to their higher productivity than single cluster tools can achieve. A challenging issue is how to schedule these tools. It is especially difficult to schedule their frequently occurring close-down processes subject to wafer residency constraints. Such processes appear frequently as caused by wafer lot switches and preventive and emergency maintenances. They are dynamical and non-cyclic. We analyze the synchronization conditions for multiple robots to perform concurrent activities. Upon these conditions, for the situations that an optimal schedule can be found in the steady state, a linear program model is proposed to find a feasible and optimal schedule for close-down processes. An example shows the application and efficiency of our proposed method.

Identifier

85027967981 (Scopus)

ISBN

[9781509046331]

Publication Title

Proceedings IEEE International Conference on Robotics and Automation

External Full Text Location

https://doi.org/10.1109/ICRA.2017.7989068

ISSN

10504729

First Page

543

Last Page

548

Grant

61673123

Fund Ref

National Natural Science Foundation of China

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