The magnetic field-assisted assembly of nanoscale semiconductor devices: A new technique

Authors

Sudhakar Shet, New Jersey Institute of Technology
Vishal R. Mehta, New Jersey Institute of Technology
Anthony T. Fiory, New Jersey Institute of Technology
Martin P. Lepselter, BTL Fellows, Inc.
N. M. Ravindra, New Jersey Institute of Technology

Document Type

Article

Publication Date

1-1-2004

Abstract

Magnetic field-assisted assembly is an integration technique for the efficient placement of a large number of nanodevices into receptor sites etched in semiconductor wafers with or without circuitry. The diverging flux from a magnetic field source helps in attaching heterostructure nanodevices into wafers. Various approaches of magnetic field-assisted assembly using air pressure, vibration assistance, fluid, and feed tape are briefly explained in this article. Magnetic field-assisted assembly is anticipated to become a manufacturing approach that will be driven by its simplicity and promise of high yield at low cost.

Identifier

9244238710 (Scopus)

Publication Title

JOM

External Full Text Location

https://doi.org/10.1007/s11837-004-0286-0

ISSN

10474838

First Page

32

Last Page

34

Issue

10

Volume

56

Recommended Citation

Shet, Sudhakar; Mehta, Vishal R.; Fiory, Anthony T.; Lepselter, Martin P.; and Ravindra, N. M., "The magnetic field-assisted assembly of nanoscale semiconductor devices: A new technique" (2004). Faculty Publications. 20552.
https://digitalcommons.njit.edu/fac_pubs/20552