Analysis of natural convection enhancement in electronics by cross-flow passages

Document Type

Article

Publication Date

1-1-2006

Abstract

Natural convection cooling of electronics holds considerable advantages over commonly used forced convection methods including the rotating fan. However, natural convection can only be applied over a limited low power density range. In this study, the feasibility of extending the range of pure natural convection cooling through the introduction of cross-flow paths in the electronic board supporting the electronic components is numerically investigated for a two-dimensional model involving vertical channels formed by the electronics boards. The fluid flow and temperature fields produced by natural convection in such a system are determined and the resulting heat transfer coefficients, and heat and fluid flow rates are analyzed. The effects of the electronic component heat rate, system dimensions, and the cross-flow path design are investigated. The results indicate up to a 180% rise of the average heat transfer coefficient on a side surface of an electronic heat source relative to that of a standard closed-board geometry system cooled by pure natural convection. Hence, for the proper design, the cross-flow passages show potential as a feasible means of significantly extending the range of pure natural convection in electronics.

Identifier

33846846269 (Scopus)

Publication Title

International Journal of Heat and Technology

ISSN

03928764

First Page

41

Last Page

49

Issue

1

Volume

24

This document is currently not available here.

Share

COinS