Post-metallization annealing of metal-tunnel oxide-silicon diodes
Document Type
Article
Publication Date
12-1-1993
Abstract
We report a post-metallization annealing study of very thin oxide (2.4-3.2 nm), aluminum gate metal-tunnel oxide-(p) silicon devices. Voltage dependence measurements of both tunnel current and high-frequency capacitance as functions of anneal time and temperature reveal that annealing the thin oxide devices after metallization leads to a decrease in interface state density, with dynamics which are similar to, though slower than, what has been observed in thicker oxide aluminum gate systems.
Identifier
0001323534 (Scopus)
Publication Title
Journal of Applied Physics
External Full Text Location
https://doi.org/10.1063/1.355311
ISSN
00218979
First Page
4780
Last Page
4782
Issue
7
Volume
74
Recommended Citation
Lundgren, P.; Andersson, M. O.; and Farmer, K. R., "Post-metallization annealing of metal-tunnel oxide-silicon diodes" (1993). Faculty Publications. 16985.
https://digitalcommons.njit.edu/fac_pubs/16985
