Simulation Techniques for the Manufacturing Test of MCMs
Document Type
Article
Publication Date
1-1-1997
Abstract
Simulation techniques used in the Manufacturing Test SIMulator (MTSIM) are described. MTSIM is a Concurrent Engineering tool used to simulate the manufacturing test and repair aspects of boards and MCMs from design concept through manufacturing release. MTSIM helps designers select assembly process, specify Design For Test (DFT) features, select board test coverage, specify ASIC defect level goals, establish product feasibility, and predict manufacturing quality and cost goals. A new yield model for boards and MCMs which accounts for the clustering of solder defects is introduced and used to predict the yield at each test step. In addition, MTSIM estimates the average number of defects per board detected at each test step, and estimates costs incurred in test execution, fault isolation and repair. MTSIM models were validated with high performance assemblies at Hewlett-Packard (HP).
Identifier
0031073274 (Scopus)
Publication Title
Journal of Electronic Testing Theory and Applications JETTA
External Full Text Location
https://doi.org/10.1023/a:1008286901817
ISSN
09238174
First Page
137
Last Page
149
Issue
1-2
Volume
10
Recommended Citation
Tegethoff, Mick and Chen, Tom, "Simulation Techniques for the Manufacturing Test of MCMs" (1997). Faculty Publications. 16945.
https://digitalcommons.njit.edu/fac_pubs/16945
