New MEMS wafer probe card

Document Type

Conference Proceeding

Publication Date

1-1-1997

Abstract

This work presents a new type of wafer probe card consisting of an array of microcantilevers actuated by bimorph heating to make contact with the contact pads on a device chip during wafer-stage testing. The microcantilevers are meant to be operated either in air or in vacuum. Bending action is created through Joule heating of a bimorph film element on the cantilever. The deflection efficiency dδ/dP ranges from 5.8 to 9.6 μ/mW (depending on lever parameters), the force efficiency dF/dP ranges from 1.4 to 5.5 μN/mW; maximum controllable (reversible) deflection is in the range of 150 μm, and contact resistance to a gold pad is approximately 1 Ω.

Identifier

0030672517 (Scopus)

Publication Title

Proceedings of the IEEE Micro Electro Mechanical Systems MEMS

First Page

395

Last Page

399

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