Design considerations for using integrated passive components

Document Type

Article

Publication Date

9-1-1997

Abstract

The demand for smaller, lighter, faster, and less expensive electronic products has led to the development of a laminate multichip module (MCM-L) process that contains integrated passive components. The University of Arkansas (UA) cooperated with Sheldahl Corporation and the Rensselaer Polytechnic Institute (RPI), as a member of the DARPA funded MCM-L consortium, to develop this integrated passive MCM-L (IPMCM-L) process. The process contains resistors, capacitors, and inductors integrated in a flexible film. Parasitic extraction, modeling, and simulation must be performed to effectively utilize this process for high performance circuits. A design methodology addressing these issues is discussed in this paper along with the process layers and example device layouts.

Identifier

3943053497 (Scopus)

Publication Title

International Journal of Microcircuits and Electronic Packaging

ISSN

10631674

First Page

297

Last Page

302

Issue

3

Volume

20

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