Broadband time-domain characterization of multiple flip-chip interconnects

Document Type

Article

Publication Date

1-1-2001

Abstract

This paper presents a comprehensive approach for the characterization of multiple flip-chip interconnects by three-dimensional finite-difference time-domain (FDTD) method. The behaviors of transition discontinuities in three coplanar waveguide (CPW) layers and four flip-chip bump interconnects are investigated for optimal packaging performance. The relationship between the reflection loss and the cross-section of bumps is discussed in detail. Results in this paper shows that FDTD is a reliable method to simulate and aid design of complicated package structures.

Identifier

0035686244 (Scopus)

Publication Title

IEEE MTT S International Microwave Symposium Digest

External Full Text Location

https://doi.org/10.1109/MWSYM.2001.967277

ISSN

0149645X

First Page

1891

Last Page

1894

Volume

1

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