Meniscus interface etching of silicon in KOH in a hands-on introductory course in MEMS

Document Type

Article

Publication Date

1-1-2001

Abstract

We describe a bulk micromachining technique for etching one side of a silicon wafer in KOH without the need for substantial protection of features on the opposite side. The approach uses meniscus properties of the etchant to draw fluid to the surface of a wafer that is suspended above the bath. Complete etching through the wafer is possible. This technique has been developed as part of a new course in MEMS that is also briefly described.

Identifier

0035162810 (Scopus)

Publication Title

Biennial University Government Industry Microelectronics Symposium Proceedings

External Full Text Location

https://doi.org/10.1109/UGIM.2001.960319

ISSN

07496877

First Page

153

Last Page

157

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