Cyclic thin film flexible pressure sensor testing

Document Type

Conference Proceeding

Publication Date

4-30-2007

Abstract

The observed test results suggest that the flexible strain sensor could endure a large number of repetitive bending cycles, i.e. 6×106 before failing. The deterioration might be due to cracks formation on the piezo-resistance semiconductor layers, delamination of the thin film layers and conduction metal. Care has been taken to ensure that the device failure is not due to the connection wire popping off from the sensor and soldering induced fault.

Identifier

34247338873 (Scopus)

ISBN

[0819465763, 9780819465764]

Publication Title

Proceedings of SPIE the International Society for Optical Engineering

External Full Text Location

https://doi.org/10.1117/12.704223

ISSN

0277786X

Volume

6463

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