Modeling of magnetic-field-assisted assembly of semiconductor devices

Document Type

Article

Publication Date

1-1-2008

Abstract

The process of magnetic-field-assisted assembly for the integration of semiconductor devices is described. A simplified model that is relevant to both magnetically assisted statistical assembly and magnetic-field-assisted assembly is presented. This two-dimensional, periodic model, which is a development of earlier work by Fonstad and coworkers, is solved using Fourier series, and an expression is found for the magnetic force of attraction between a soft magnetic layer and an array of permanently magnetized strips. The results show an exponential decrease of force with distance and the dependence of the force on other parameters such as layer thickness and spacing. © 2007 TMS.

Identifier

39849083360 (Scopus)

Publication Title

Journal of Electronic Materials

External Full Text Location

https://doi.org/10.1007/s11664-007-0351-x

ISSN

03615235

First Page

374

Last Page

378

Issue

4

Volume

37

Fund Ref

State of New Jersey Commission on Science and Technology

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