Date of Award

Spring 2001

Document Type

Dissertation

Degree Name

Doctor of Philosophy in Applied Physics - (Ph.D.)

Department

Federated Physics Department

First Advisor

Ken K. Chin

Second Advisor

Wenquan Sui

Third Advisor

Zhen Wu

Fourth Advisor

John Charles Hensel

Fifth Advisor

Hui Wu

Abstract

Whole package analysis is becoming more and more important with the rapid expansion of high frequency electronics. The motivation of this thesis is to find and implement a new method for broadband whole package simulation. 3-dimension (3-D) whole package Finite Difference Time Domain (FDTD) simulation result was first reported in detail in this thesis.

The FDTD method is a widely used full-wave time-domain simulation method used in the design and analysis for electromagnetic (EM) systems, such as antennas, wave propagating, and microwave circuits. Absorbing boundary condition (ABC), such as the perfect matched layer (PML) method, makes it possible to accurately analyze an EM structure involving complicated wave propagation in three-dimensional domain. Instead of running simulation at each frequency, time-domain solution gives complete frequencydomain response including coupling and dispersion effects. Chapter2 introduces the principle of FDTD and two important boundary condition methods. It also discusses the nonuniform grid numerical error, and gives the FDTD simulation and theoretical result.

Flip chip package is one of the most important package types. Chapter 3 presents a wide band approach for characterizing multiple flip chips interconnects by the FDTD method. Detailed analysis for electrical performance for frequencies up to 40 GHz has been performed with variations of interconnect bumps (ball cross section and via cross section). Flip chips of three sizes are studied using FDTD method in detail. The relationship between reflection loss, via pad length, ball crosssection and via cross section is tabulated for future packaging design. Based on the simulation results, some design approaches are proposed for packaging structure operating at near 40 GHz.

FDTD whole package simulation method is introduced at the beginning of Chapter 4, followed by discussion how to implement this method to specific packages. The packages used to host circuit in chapter 4 are microstrip line and fiip chip interconnects. The embedded circuits are ideal transmission line and an HP amplifier. Transient effects are observed when an amplifier is hosted in a package. Most of the simulations are processed under three-dimensional environment; twodimensional simulation is used for reference standard. All these results were first reported by the author of this thesis and his collaborators.

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